Kawasan Perindustrian Bukit Minyak , Simpang Ampat
Simpang Ampat, Penang
RM 16,800,000
Property Type
Listing Type
Property ID
20241120114653
Location
Listed By
WhatsAppSpecifications
The Edge Headline
Kawasan Perindustrian Bukit Minyak , Simpang Ampat , Penang
Tenure
Land Area
94960
Built Up Area
26800
Bumiputera Lot
No
Furnishing
Car Park
Rent Deposit
168000
Postcode
Property Guru Area
Property Guru Township
Taman Perindustrian Bukit Minyak
Negotiable
No
New Launch Units
-
Auction Date
20-11-2024 11-20
Auction Number
-
Title Type
Land Title Type
Occupancy
Unit Type
Year Built
2024
Description
LAND AREA: 94,960 sqft
PRODUCTION AREA: 16,000 sqft
OFFICE AREA: 10,800 sqft
TOTAL BUILD-UP: 26,800 sqft
CEILING HEIGHT: 30 FT
POWER SUPPLY: 800 AMP ( CAN UPGRADE TO 1200 AMP )
FLOOR LOADING CAPACITY: 2 TON
-Completion on SEPTEMBER 2024
-CCC ready end of December 2024
SELLING PRICE: RM16,800,000.00
CONTACT ME
CRYSTAL TEE
016 559 6624
Loan & Insurance Calculator
Estimates onlyRates: Bank Negara Malaysia (indicative effective lending rate), refreshed daily. Tap a bank to apply its rate.
Monthly Instalment
-
Loan Amount
-
Total Interest
-
MRTA vs MLTA Comparison
Indicative estimates - actual premiums depend on insurer, health & plan| MRTA | MLTA | |
|---|---|---|
| Estimated Premium | - | - |
| Payment | One-off (usually financed into loan) | Monthly / yearly premium |
| Coverage | Reducing - follows loan balance | Level - fixed sum assured |
| Beneficiary | Bank (settles the loan) | Family (loan settled, balance to family) |
| Cash Value | None / minimal | Yes - may have cash value |
| Transferable | Tied to this loan | Portable to next property |
All figures are estimates for reference only and do not constitute financial advice. Loan approval, interest rates and insurance premiums vary by bank, insurer, age, health condition and coverage chosen. Please consult your banker or licensed financial adviser for exact quotations.
Nearby Places
Map data © OpenStreetMap contributors. Approximate location based on property name and area.